Products

In the electronics industry—including semiconductor and SMT sectors—air bubbles can form during manufacturing processes such as DAF, UF, and LCD production. By precisely controlling pressure (positive and negative) and temperature parameters, these bubbles can be effectively reduced or eliminated.
Key Features
>98% degassing rate | Large 600mm chamber
Applications
Die attach curing | Underfill curing | Wafer lamination, etc.

The world's most popular acoustic microscope, used for routine laboratory analysis and component screening applications.

The Quadra 5 Pro delivers outstanding capabilities and sub-micron image quality. It shares many of the same accessories as the Quadra™ 7 Pro, including µCT acquisition stages, X-ray dose filters, and thin sample trays.

The STELLAR 4000 is the preferred platform for manual pull and shear strength testing in routine production. It can be configured as a simple wire pull tester or upgraded to perform solder ball shear, die shear, and various pull/shear tests, including ball pull testing.

Batch plasma processing systems offer small, medium, and large vacuum chamber options, providing process correlation, controller continuity, and reliable, repeatable vacuum gas plasma processing.

MYS Series – MYW10 Plasma System
Enabling highly flexible, high-throughput wafer surface treatment processes
With the rapid growth of the electronics assembly and semiconductor markets, industry demands for production efficiency and reliability continue to rise. By eliminating the wait times associated with traditional vacuum-based plasma processing, the MYS series cleaning equipment delivers significantly higher throughput and improved overall yields, while ensuring the safe handling of all sensitive electronic components.