The core function of dispensing and coating machines lies in precision dispensing, coating, potting, and sealing—facilitating bonding, insulation, moisture protection, thermal conductivity, and structural reinforcement. These applications span a wide range of sectors, including electronics, automotive, new energy, medical devices, lighting, and industrial electrical equipment.
I. Electronics Manufacturing (Core Application Scenario)
PCB & SMT: SMT red glue fixation, wave soldering masking, PCB conformal coating, solder joint reinforcement, and component bonding.
Chip Packaging: IC encapsulation, COB bonding encapsulation, BGA underfill, and thermal/insulating adhesive coating.
Consumer Electronics: Mobile phone frame sealing, camera/receiver fixation, battery bonding, screen-to-mid-frame bonding; laptop/tablet casing sealing, FPC reinforcement, and camera module dispensing.
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