Semiconductor Packaging Process Flow

Complete Semiconductor Packaging Process Flow

Wafer Dicing: Dividing the entire wafer into individual bare dies

Die Bonding: Mounting the die onto the lead frame or substrate

Wire Bonding: Connecting the die pads to the lead frame using gold or copper wires

Molding: Encapsulating the die circuitry in epoxy resin for protection

Curing: Hardening and setting the encapsulant to enhance stability

Deflashing & Grinding: Removing excess molding material and smoothing the surface finish

Lead Plating: Tin-plating the leads to prevent oxidation and improve solderability

Laser Marking: Engraving the model number, batch code, and specifications

Lead Trimming & Forming: Separating the finished leads and bending them into the required shape

Electrical Testing: Verifying electrical connectivity, functionality, and voltage withstand capability

Visual Inspection: Screening for visual defects, dimensional accuracy, and cosmetic flaws

Tape & Reel Packaging: Packaging the finished devices for warehousing and shipment