In the electronics industry—including semiconductor and SMT sectors—air bubbles can form during manufacturing processes such as DAF, UF, and LCD production. By precisely controlling pressure (positive and negative) and temperature parameters, these bubbles can be effectively reduced or eliminated.
Key Features
>98% degassing rate | Large 600mm chamber
Applications
Die attach curing | Underfill curing | Wafer lamination, etc.
CKD Technology not only has brand new machines in stock, available immediately.
We also have detailed renting business, ready to serve your specific production requirement while significantly lowering your initial investment. Contact us for more details.
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Effectively handles degassing and curing processes for resins (adhesives) with curing temperatures below 200°C, solving the challenge of air bubbles in the electronics industry.
Utilizes a [Vacuum-Pressurization] cyclic curing process, cleverly employing "low-viscosity breathing" control techniques to induce the escape of gas trapped within the resin.
● Degassing rate >98%
Alternating vacuum and high-pressure cycles ensure a high degassing rate of over 98%.
● Saves curing time
Adjustable curing temperature profiles; supports external temperature monitoring.
Built-in cooling system for rapid temperature reduction.
● Large 600mm chamber
Equipped with a large 600mm chamber to accommodate more products; suitable for degassing and curing all resins (adhesives) requiring temperatures below 200°C.
Hot Tags: PO Series Vacuum Oven, Vacuum Pressure Oven Supplier, Industrial Drying Oven
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