Shenzhen CKD Technology Co., Ltd.
Shenzhen CKD Technology Co., Ltd.
Products

Products

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ASF100

ASF100

The ASF100 dispensing system offers significant advantages in dispensing efficiency and delivers excellent cost-performance value.
It features precision ball screws and servo motors across all three axes (X, Y, and Z) and utilizes user-friendly software to ensure system stability and reliability. Its in-line conveyor design supports integration with single- or dual-track systems and enables product flipping to meet requirements for dispensing on both the top and bottom sides. Developed specifically for applications requiring double-sided dispensing, this fully automated in-line jet dispensing system is backed by a broad, established customer base and delivers tangible, substantial returns on investment.
Ai100 Y extended

Ai100 Y extended

The Au series of fully automated dispensing equipment integrates various dispensing technologies to provide a wide range of fully automated, in-line dispensing solutions.
The Ai100 (featuring an extended Y-axis) utilizes a high-end non-contact jetting valve to enhance dispensing uniformity and throughput while minimizing material waste. Proven in demanding production environments, the Au series automated jet dispensing solutions capably handle high-precision applications—such as encapsulation, underfilling, bonding, and assembly—for complex products. Key applications include consumer electronics, such as hot-melt adhesive bonding, underfilling, surface mount technology (SMT), package-on-package (PoP) assembly, dam-and-fill processes, FPC component reinforcement, and the application of reinforcing materials.
Au99s Inline Dispensing Systems for the Semiconductor Industry

Au99s Inline Dispensing Systems for the Semiconductor Industry

Au99s,具有明显的高性价比优势,性能可靠,设计精简。
采用直线电机搭配微米分辨率光柵尺闭环控制,大大提高系统运行速度与精度。配备简单友好的操作界面,确保系统稳定可靠。该系统为半导体封装 FPC/PCB组装等产品的精密点胶应用而设计,点胶区域达到 350mmx480mm。 axxon在全国建立了广泛的支持与服务网络,为客户在研发验证,生产制造,产品创新等各个环节提供完整的解决方案。重点应用:芯片级底部填充 、Dome Coating 、Dam & fill 、 No-flow underfill 、 Glob top 、银浆 、锡膏等。
Au99L

Au99L

The Au99L dispensing system offers significant advantages in dispensing efficiency and delivers excellent cost-performance value. It features precision ball screws and servo motors across all three axes (X, Y, and Z) and utilizes user-friendly software to ensure system stability and reliability.
The Au99L is a fully automated, in-line jet dispensing system specifically developed for lens assembly applications on LED light bars. It boasts a broad and well-established customer base, delivering tangible, substantial returns on investment. Axxon has built an extensive nationwide support and service network, providing comprehensive process solutions to assist customers with development, manufacturing, and product innovation. Key applications include consumer electronics, LED light bar dispensing, hot-melt adhesive bonding, underfilling, surface mount technology (SMT), stacked packaging, dam-and-fill processes, FPC component reinforcement, and the application of reinforcing materials.
Au99C

Au99C

The Au99C platform is designed to meet Class 100 cleanroom standards and is specifically engineered for environmentally controlled production workshops.
The Au series of fully automated dispensing systems integrates various dispensing technologies to offer a wide range of fully automated, in-line dispensing solutions. Proven in demanding production environments, the Au series—featuring fully automated jet dispensing—reliably handles high-precision applications such as encapsulation, underfilling, bonding, and assembly for complex products. Key applications include consumer electronics, such as hot-melt adhesive bonding, underfilling, surface mount dispensing, package-on-package (PoP) assembly, dam-and-fill processes, FPC component reinforcement, and the application of reinforcing materials.
Au99M

Au99M

The Au99M platform utilizes high-speed linear motor drive control to further enhance production efficiency.
The Au series of fully automated dispensing equipment integrates various dispensing technologies to offer a wide range of fully automated, in-line dispensing solutions. Proven in demanding production environments, the Au series automated jet dispensing solutions capably handle high-precision applications—such as encapsulation, underfilling, bonding, and assembly—for complex products. Key applications include consumer electronics, such as hot-melt adhesive bonding, underfilling, surface mount technology (SMT), stacked package assembly, dam-and-fill processes, FPC component reinforcement, and the application of reinforcing materials.
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