Easily handles surface treatment for sensitive components
- Contact-capable argon plasma
- Generates no sparks, arcs, dust, UV radiation, or excessive heat
- No electrostatic discharge (ESD) risk for sensitive electronic components (e.g., wafers, lead frames, semiconductor packaging parts)
| Basic Parameters | MYS Plasma Surface Treatment System Platform |
| Power Requirements | 220 V, 2 kW, 10 A, 60 Hz |
| Gas Requirements | 90 psi (6 bar) |
| Dimensions (W x D x H) | 1,200 x 770 x 1,400 mm |
| Weight | 650 kg |
| Certification | CE |
| Positioning Accuracy | XY: ±30 µm @ 3σ; Z: ±10 µm @ 3σ |
| X, Y, Z Axis Repeatability | XY: ±15 µm @ 3σ Z: ±5 µm @ 3σ |
| Maximum speed | 1,000 mm/s (X, Y) |
| Acceleration | 1.0 g |
| Camera resolution | 640 x 480 px (0.3 MP) |
| Drive system | AC servo |
| Conveyor type | Belt |
| Conveyor load capacity | 3 kg |
| Minimum product width | 50 mm |
| Maximum product width | 475 mm |
| Minimum product length | 50 mm |
| Maximum product length | 350 mm |
| Software operating system | Windows 7 |
| Product thickness range | 0.5–6 mm |
| Communication protocol | SMEMA |
| Plasma treatment area (D x W) | 475 x 350 mm |
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| Basic specifications | Plasma System Requirements |
| RF Power | 600W at 27.12 MHz |
| Primary Plasma Gas | Argon |
| Process Gas | O2, N2, or H2 (others subject to testing) |
| Gas Supply Pressure Range | 30–100 psig (0.2–0.7 MPa) |
Address
5th Floor, Building 2, No. 182, Chang'an Xi'an Road, Chang'an Town, Dongguan, Guangdong Province, China.
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