Products

Chip substrate dispensing line is an advanced automated system designed for high-precision adhesive, underfill, and material dispensing in semiconductor packaging processes. It supports stable production for global electronics manufacturers and is widely supplied by China manufacturer factories.

D-Tec 3D Inspection is an intelligent three-dimensional inspection solution designed for high-precision industrial measurement, defect analysis, and automated quality verification. It helps manufacturers improve accuracy, reduce manual inspection errors, and optimize production efficiency.