K-Series Vacuum Reflow Soldering Equipment

CKD Technology not only has brand new machines in stock, available immediately.

We also have detailed renting business, ready to serve your specific production requirement while significantly lowering your initial investment. Contact us for more details.

CKD has a team of professional engineers, ready to deliver turn key service.

For trading of used machines, please contact us via Whatspp or email.

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This equipment integrates high-volume, stable hot-air reflow soldering with vacuum soldering capabilities, providing customers with an automated, in-line solution that delivers high throughput and low-voiding performance (total void area of less than 5%). The vacuum module is installed within the reflow oven, allowing for precise control of the vacuum evacuation rate while replicating standard reflow temperature profiles to enable in-line soldering.

● Heating Technology

Utilizes proprietary high-static-pressure hot-air circulation heating technology to meet the soldering requirements for both large components (such as ceramic BGAs) and high-density small components on PCBA products; the effective heating length ratio per zone in the SONIC reflow system exceeds 84%.

● Voiding Rate

Voiding rate is less than 5%, enhancing electrical conductivity and thermal dissipation performance while extending product lifespan.

● Three-Stage Intelligent Board Transport System

Heating Zone — Vacuum Chamber — Cooling Zone

● User-Friendly Control Interface

Equipped with an international-brand PC and dedicated software running on a Windows interface; the interface is intuitive, making production parameters clear at a glance.

● Low Maintenance Costs

Modular design allows for easy assembly/disassembly and convenient inspection; requires minimal maintenance.

Advanced Vacuum Chamber Design

Advanced vacuum chamber design ensures excellent sealing performance and equipment longevity; proprietary active heating via medium-wave infrared glass-ceramic plates guarantees soldering process reliability.

Independent Vacuum Pump Design

Independent vacuum pump design minimizes vibration impact on the vacuum chamber: ensures a reliable and stable vacuum process, supports multi-stage (stepped) evacuation, and features an external configuration for quick and convenient maintenance.

Excellent temperature uniformity; meets lead-free process requirements involving significant variations in thermal mass

Utilizes an innovative airflow rectification plate to enhance temperature uniformity, minimize temperature distribution deviations, and reduce both thermal and electrical energy consumption.

High-precision temperature control within ±1°C

Maintains the temperature of the airflow heating the PCB surface within ±1°C across all heating zones.

Dual-rail system with synchronized movement

Accommodates various board sizes and increases production capacity.

Conveyor system

Utilizes an innovative rolling chain combined with an active micro-lubrication system to eliminate sliding friction between the chain and guide rail. This reduces tensile stress on the assembly—preventing rail deformation—while actively lubricating the chain and rail to meet real-time lubrication needs, thereby ensuring the stability and longevity of the transport system.

Cooling System Supporting Non-Stop Maintenance

Modular design allows for quick disassembly and easy maintenance, enabling servicing without halting production.

● Evaporator features a new detachable filter screen design with an extended maintenance interval.

● The evaporator filter screen can be quickly removed, facilitating maintenance without stopping production.

Nitrogen System

Achieves 500 ppm across all zones (standard); 100 ppm capability available (optional).