K-Series Lead-Free Hot Air Reflow Soldering Equipment
Utilizes proprietary high-static-pressure hot-air circulation and high-efficiency heating technology to ensure superior heating efficiency and precision; designed to meet the soldering requirements of high-density, miniaturized, and integrated SMT components, it is a powerful tool for achieving low-carbon, low-operating-cost manufacturing.
Key Features
84% effective heating area | Temperature control within ±1°C
CKD Technology not only has brand new machines in stock, available immediately.
We also have detailed renting business, ready to serve your specific production requirement while significantly lowering your initial investment. Contact us for more details.
CKD has a team of professional engineers, ready to deliver turn key service.
For trading of used machines, please contact us via Whatspp or email.
Utilizing proprietary high-static-pressure hot-air circulation heating technology, this system delivers superior heating efficiency and precision. It meets the soldering requirements for high-density, miniaturized, and integrated SMT components, serving as a powerful tool for achieving low-carbon, low-operating-cost manufacturing.
● Heating Technology
Features proprietary high-static-pressure hot-air circulation heating technology, meeting soldering requirements for a wide range of PCBA components—from large parts like ceramic BGAs to high-density, miniaturized components. The effective heating length ratio per zone exceeds 84%.
● Temperature Control Precision
Temperature control precision within ±1°C.
● Recognized by Global and Domestic Customers
A reflow soldering system trusted by top 500 companies worldwide.
● Simple, User-Friendly Control Interface
Equipped with an international-brand PC and dedicated software running on a Windows interface; the system is easy to operate, offering a clear view of production process parameters.
● Low Maintenance Costs
Modular design allows for easy assembly/disassembly and convenient inspection; requires minimal maintenance.
Excellent temperature uniformity; meets lead-free process requirements for components with varying thermal capacities.
Utilizes an innovative airflow rectification plate to enhance temperature uniformity, minimize temperature distribution variance, and reduce both thermal and electrical energy consumption.
High-precision temperature control within ±1°C
Airflow temperature at the PCB surface within all heating zones is controlled to within ±1°C.
Dual-rail system with independent control and differential speed capability
Capable of processing products with varying dimensions and heat absorption rates.
Conveyor system
Utilizes an innovative rolling chain design combined with an active micro-lubrication system. This eliminates sliding friction between the chain and rail, reduces tensile stress, and prevents rail deformation. Active lubrication of the chain and rail ensures immediate lubrication, thereby guaranteeing the stability and longevity of the conveyor system.
Cooling system allowing maintenance without production stoppage
Modular design allows for quick disassembly and easy maintenance, enabling servicing without halting production.
● Separable design for the new evaporator filter screen; extended maintenance intervals.
● The evaporator's new filter screen is quickly detachable, enabling maintenance without halting production.
Nitrogen System
Achieves 500 ppm across the entire zone (standard); 100 ppm capability available (optional).
Hot Tags: Lead-Free Hot Air Reflow Soldering Equipment Supplier, K-Series Reflow Oven Manufacturer, PCB Reflow Soldering Machine Wholesale
If you have any inquiry about a quotation or cooperation, please feel free to email or use the following inquiry form. Our sales representative will contact you within 24 hours.
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