Durable Axxon Conformal Coating Systems for Superior Circuit Protection

The Au series of fully automated dispensing equipment integrates various dispensing technologies to provide a wide range of fully automated, in-line dispensing solutions.
The Ai100 (featuring an extended Y-axis) utilizes a high-end non-contact jetting valve to enhance dispensing uniformity and throughput while minimizing material waste. Proven in demanding production environments, the Au series automated jet dispensing solutions capably handle high-precision applications—such as encapsulation, underfilling, bonding, and assembly—for complex products. Key applications include consumer electronics, such as hot-melt adhesive bonding, underfilling, surface mount technology (SMT), package-on-package (PoP) assembly, dam-and-fill processes, FPC component reinforcement, and the application of reinforcing materials.

Au99s，具有明显的高性价比优势，性能可靠，设计精简。
采用直线电机搭配微米分辨率光柵尺闭环控制，大大提高系统运行速度与精度。配备简单友好的操作界面，确保系统稳定可靠。该系统为半导体封装 FPC／PCB组装等产品的精密点胶应用而设计，点胶区域达到 350mmx480mm。 axxon在全国建立了广泛的支持与服务网络，为客户在研发验证，生产制造，产品创新等各个环节提供完整的解决方案。重点应用：芯片级底部填充 、Dome Coating 、Dam & fill 、 No-flow underfill 、 Glob top 、银浆 、锡膏等。

The Au99L dispensing system offers significant advantages in dispensing efficiency and delivers excellent cost-performance value. It features precision ball screws and servo motors across all three axes (X, Y, and Z) and utilizes user-friendly software to ensure system stability and reliability.
The Au99L is a fully automated, in-line jet dispensing system specifically developed for lens assembly applications on LED light bars. It boasts a broad and well-established customer base, delivering tangible, substantial returns on investment. Axxon has built an extensive nationwide support and service network, providing comprehensive process solutions to assist customers with development, manufacturing, and product innovation. Key applications include consumer electronics, LED light bar dispensing, hot-melt adhesive bonding, underfilling, surface mount technology (SMT), stacked packaging, dam-and-fill processes, FPC component reinforcement, and the application of reinforcing materials.

The Au99C platform is designed to meet Class 100 cleanroom standards and is specifically engineered for environmentally controlled production workshops.
The Au series of fully automated dispensing systems integrates various dispensing technologies to offer a wide range of fully automated, in-line dispensing solutions. Proven in demanding production environments, the Au series—featuring fully automated jet dispensing—reliably handles high-precision applications such as encapsulation, underfilling, bonding, and assembly for complex products. Key applications include consumer electronics, such as hot-melt adhesive bonding, underfilling, surface mount dispensing, package-on-package (PoP) assembly, dam-and-fill processes, FPC component reinforcement, and the application of reinforcing materials.

The Au99M platform utilizes high-speed linear motor drive control to further enhance production efficiency.
The Au series of fully automated dispensing equipment integrates various dispensing technologies to offer a wide range of fully automated, in-line dispensing solutions. Proven in demanding production environments, the Au series automated jet dispensing solutions capably handle high-precision applications—such as encapsulation, underfilling, bonding, and assembly—for complex products. Key applications include consumer electronics, such as hot-melt adhesive bonding, underfilling, surface mount technology (SMT), stacked package assembly, dam-and-fill processes, FPC component reinforcement, and the application of reinforcing materials.

The compact Au77s utilizes a high-end non-contact jetting valve to enhance dispensing uniformity and throughput while minimizing material waste. The Au series of fully automated dispensing systems integrates various dispensing technologies to provide diverse in-line dispensing solutions. Proven in demanding production environments, the Au series jet dispensing solutions capably handle high-precision applications—such as encapsulation, underfilling, bonding, and assembly—for complex products. Key applications include consumer electronics, hot-melt adhesive bonding, underfilling, surface mount technology (SMT), package-on-package (PoP) stacking, dam-and-fill processes, FPC component reinforcement, and material strengthening.