The DH series dispensing machines feature an advanced design suitable for diverse production environments, offering exceptional cost-effectiveness. With comprehensive configurations tailored to various processes, they meet the dispensing requirements for substrates and base materials of different specifications. The use of non-contact jetting valves ensures dispensing uniformity, boosts productivity, and minimizes material waste. By integrating various dispensing technologies, we provide customized solutions tailored to specific customer needs.
The D/DH series is primarily used for underfill, pin encapsulation, precision coating, PoP (Package-on-Package) stacking, dam-and-fill, SMT red glue processes, COB packaging, hot-melt adhesive bonding, and FPC component reinforcement.
Product Specifications
DH Series
X/Y/Z Repeat Position Accuracy
±15μm @ 4σ (Cpk > 1.33)
Motion-Driven Mode
Servo Motor + Ball Screw
Max. XYZ Axis Speed
800/800/400 mm/s
Dispensing Range (Max/Min PCB Size)
DH Series: XY 50×50 ~ 510×686 mm
Customizable Conveyor Options
Single-lane / Dual-lane / Bottom heating / Three-stage independent transport
If you have any inquiry about a quotation or cooperation, please feel free to email or use the following inquiry form. Our sales representative will contact you within 24 hours.
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