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Shenzhen CKD Technology Co., Ltd.
Shenzhen CKD Technology Co., Ltd.
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Semiconductor Packaging Process Flow22 2026-05

Semiconductor Packaging Process Flow

Wafer Dicing: Dividing the entire wafer into individual bare dies
Die Bonding: Mounting the die onto the lead frame or substrate
Applications of Dispensing and Coating Machines22 2026-05

Applications of Dispensing and Coating Machines

The core function of dispensing and coating machines lies in precision dispensing, coating, potting, and sealing—facilitating bonding, insulation, moisture protection, thermal conductivity, and structural reinforcement.
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